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 | IPIII E |
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 | Pick and Place SMT |
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Specifications
 SPEED 7,000 CPH
MAX PCB 457 x 356 MM
Component range: 1005 (0402) chips to 74mm2 QFP
Capable of placing BGA TAB etc
Placement accuracy of ±0.025 mm
Multi-Tray Unit
Multi-Feeder Units
Features
By strengthening the macine body the IPIII is now able to acheive higher accuracy placments. All parts in the IPIII have been manufactures to exacting standard to ensure long term usage and highly reliable operation.
| |  | The use of leading technology and proprietory algorithms enables high accuracy placements. The resolution has been doubled to 2048 pixels and gey scale image processing now replaces the binary system. Discrepancies in positioning are calculated and compensated via the fiducial marks and lead uniformity is accurately detected. If required a traditional 1024 camera can also be used.
By operating the both the X-axes and Y-axes on a closed loop linear scale highly accurate positioning can be acheived.
The placing accuracy for rectangular chips, MELF, SOIC and PLCC devices +/- 0.1mm. For QFP, GQFP and other fine pitche parts, the accuracy can be increased to +/- 0.025mm (2048 pixels) and +/- 0.03mm (1024 pixels)
Accomodating a greater variety of parts, both nozzles changers can handle up to 6 types of nozzles (for a total of twelve nozzle ports)
Servo motors control vertical movement of nozzles and there is an optional pressure control function. This function controlls the amount of pressure placed on parts during placement.
Board sizes of 50 (W) x 80 (L) mm to 457 (W) X 508 (L)mm can be handled
The IPII will run on all compatible Fuji controller software including F4G, Fuji Flexa and MCS30
Fuji IP Feeders
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