Components are located over a wave of solder whose shape matches the lead pattern. Solder flows for seconds against the bottom of the board, transmitting heat to the leads. When joints are molten, the component is removed.

Holes are cleaned with low pressure air and the new component is inserted and re-soldered. You can also use the equipment purely as a low volume selective soldering machine by using special nozzles.

  Lead-Free & thermally challenging assemblies.
  Minimal Copper dissolution in PCB barrels.  
  Uniform heating. Precise operating controls and alignment system. Quick component removal and soldering.
  Well design for trouble-free operation.

PCBRM System 5.2

  Physical Dimensions: 76”W x 33”D x 28”
  Board Carrier Size: 24”W x 20”D
  Solder Capacity: 35 lbs. Weight with Solder: 230 lbs.
  Compressed Air: 40-80 psi, clean moisture free
  Electrical: 45 amps 3 Phase, 50/60Hz, 10K watts

System is supplied with: Handbooks, Selection of Nozzles’, Work Station Bench