Modular High Speed Pick and Place

The QP242 is designed to be a modular, high speed, fine pitch Pick and place SMT machine. The modularity of the machine enables the user to match the machine specifications to the product and production needs. The machine can be purchased with one to to six different 'modules' per control unit making it a highly flexible pick and place SMT machine.

The user can select one of the six different modules for the machine. Each module is designed to handle a specific type of SMT component size from 1005 to 74 x 74mm QFP's, BGA and flip chips.

Also available is a Tray feeder option, This can be fitted with the machine when sold or retro-fitted at a later date and as it behaves like a feeder cart, can be added or removed as required.


Specifications
SPEED from 2,000CPH
MAX PCB 457 x 356 MM
Component range 1005 to 74mm sq
Speed: 2,000 up to 14,000 cph
Modular multi-purpose machine
Up to six modules
BGAs, CSPs, CCGAs and QFP up to a max height of 25.4mm
Accuracy: Chips +/- 0.1mm, Fine pitch +/- 0.04mm
Options: MTU7; Type 7 camera; STU


AlternativeSMT currently has the following configuration available

Fuji QP242 Multi Functional Pick and Place SMT machine - 4 Module
Controller - ICM-101 Main Control Module
Module 1 - BI603 & MFU5 21x 8mm feeder slots
Module 2 - BI603 & MFU5 21x 8mm feeder slots
Module 3 - BS604 & MFU5 21x 8mm feeder slots, nozzle changer
Module 4 - BI604 & MFU5 21x 8mm feeder slots



*1 - Specify the device supply direction when placing the order
*2 - For details on the nozzle head and camera configuration, refer below for 'Camera Specifications'
*3 - If the index type head is used in conjunction with the line-scan camera, the component size range is 1.0 x 1.0mm to 38 x 38mm
*4 - Contact Fuji for information on parts, flux, etc. for module types: FS (BS)-606, 706, 806



*1 - The accuracy figures above were obtained from Fuji standards tests with glass parts, PCBs, and fiducial referencing, and may vary depending on the type of camera, the condition of parts, etc.
The placing accuracy for parts with leads on all (four) sides when processed by camera 2,3,4 or 7 is ±0.04mm
*2 - The placing rate varies depending on the camera type, the number of leads or bumps, and the part size and shape. Placing time will also be lengthened if functions such as placing pressure control, soft landing, and traverse-speed control are used together
*3 - Tombstoning may go undetected when the camera type no.2 us used for 2125 (0805) chips
*4 - Tombstoning may go undetected when the camera type no.3 is used for 3216 (1206) chips
*5 - Foreground lightin is not possible for parts such as rectangular chips and minimolds
At present only QFPs, SOICs, PLCCs and SOJs can be processed by means of foreground lighting. Special arrangements are required in order to use foreground lighting for parts such as connectors.

Fig.1 - STU